FORUM be-flexible 2008, December 2 and 3, 2008 - CALL FOR PAPERS
Thin Semiconductor Devices - Flexible Electronic Systems, venue hotel LeMeridien in Munich
Deadline for submission of abstracts extended to July 6, 2008
The forum be-flexible 2008, december 2 - 3 has been initiated by Fraunhofer IZM-Munich to face present and future challenges concerning research, technology, integration, manufacturing and trends in the fast evolving world of flexible electronics. This international platform is intended for an exchange of experiences of scientists, applied researchers, equipment suppliers and users. Learn about the latest developments, applications and equipments and get in touch with the leading companies and suppliers. The past workshops enjoyed great popularity and we are pleased to announce these workshops again in 2008. It is designed of two consecutive days with several sessions and keynote speakers for special foc:.
Dear Customer and Project Partner,
Again this year we present the Forum be-flexible 2008, December 2 and 3, at the Hotel LeMeridien in Munich, with a subsequent Open Day on December 4 at the Fraunhofer IZM’s facilities in Munich.
As in the past years, we would like to give you the opportunity to present your latest developments, recent successes and approaches to an international audience.
Also in 2008 we have invited speakers for special foci, see details on the web.
Topics on December 2, 2008, Thin Semiconductor Devices
- thin wafer processing,
- process technology and equipment
- thin MEMS and sensors and packaging
- thin dies, stacked dies, selfassembly
Topics on December 3, 2008, Flexible Electronic Systems
- smart and flexible systems
- production technologies for flex
- organic electronics and functional materials
- hetero integration for large areas
Deadline for submitting abstracts now extended to July 6, 2008,
please note that slots for presentations are limited
See more details on www.be-flexible.de, including the form for submitting abstracts
Title of presentation max 55 characters including blanks
Abstract max 1500 characters including blanks
Speaker’s bio and picture max 1500 characters including blanks
Company’s name and address max 150 characters including blanks (link optional)
As last year we offer special fees for speakers - 350 Euro – and the speaker bonus will be also granted for attending the other workshop day
Notification of acceptance by July 8, 2008
Please feel free to contact me for any questions.
Looking forward to hearing from you
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Fraunhofer Institute of Reliability and Microintegration - Munich Department Polytronic Systems Hansastr. 27d, 80686 Munich, Germany