3D-printed 'smart cap' uses electronics to sense spoiled food
UC Berkeley engineers, in collaboration with colleagues at Taiwan’s National Chiao Tung University, have expanded the range of 3D printing technology to include electrical components, successfully printing a wireless “smart cap” for a milk carton that detects signs of spoilage using embedded sensors.
http://news.berkeley.edu/2015/07/20/3d-printed-electronic-smart-cap/
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